SBIR Phase II: Monolithic CMOS-Integration of Electroplated Copper MEMS Inertial Sensors
The broader impact/commercial potential of this project can lead to a revolution in the consumer electronics market(mobile handsets, tablets, game consoles and wearables), wherein high performance, low power, small footprintmultisensing (not limited to inertial sensing) platforms with timing devices, are all directly microfabricated on a commonASIC substrate. Sensor fusion can produce unprecedented user experiences by using data collected from all sensors andprocessed using machine learning algorithms. This can further boost the sensor and timing markets that are expected toexceed $6 billion dollars by 2017. Moreover, the emergent Internet of Things (IoTs) and wearable markets are expected toreach $20 billion dollars by 2025, which can induce a rapid growth of such intelligent sensor fusion market. This can havea tremendous societal impact as wearable devices and IoT systems, interfaced with mobile platforms, can be used tomonitor people?s health, safety and energy consumption. Making these solutions affordable will make it amenable to lowincome households not only in the US but also around the world. It will also enable researchers to attain new frontiers ofknowledge such as in digital sensory systems. The long-term goals are to provide such intelligent sensor fusion solutions.This Small Business Innovative Research (SBIR) Phase 2 project seeks to demonstrate wafer-scale microfabrication ofMicro-Electro-Mechanical Systems (MEMS) inertial sensors directly on the application specific integrated circuit (ASIC)substrates, by using electroplated copper (e-Cu) as a structural material. MEMS inertial sensors, such as gyroscopes andaccelerometers, are pervasively used in consumer electronics and automotive industries. Current trends are, however,requiring higher device performance with smaller footprints, wherein multi-degree-of-freedom sensors are integrated onthe same package, to enable new capabilities and user experiences. These requirements can be met by monolithicallyfabricating inertial sensors on ASIC substrates, which is complex to achieve with silicon as a structural material. Using e-Cu, which is currently used for ASIC metal interconnects, as the structural material, can enable easier routing toimplement optimized mechanical structures, smaller dimensions given the high density of copper, extremely low cost asno wafer bonding is required, smaller form factors, multiple sensors on a single die, and much smaller parasitics providinglow noise and higher performance. Phase II tasks will be to wafer-scale fabricate an inertial measurement unit that ismonolithically integrated with its ASIC with optimal performance parameters.
The broader impact/commercial potential of this project can lead to a revolution in the consumer electronics market<br/>(mobile handsets, tablets, game consoles and wearables), wherein high performance, low power, small footprint<br/>multisensing (not limited to inertial sensing) platforms with timing devices, are all directly microfabricated on a common<br/>ASIC substrate. Sensor fusion can produce unprecedented user experiences by using data collected from all sensors and<br/>processed using machine learning algorithms....
- Initiates the design, development, execution and implementation of scientific research projects to fuel InSense growth.
- Investigates the feasibility of applying scientific principles and concepts to potential inventions and products. Plans and executes laboratory research.
- Maintains substantial knowledge of state-of-the-art principles and theories, and contributes to scientific literature and conferences.
- May participate in development of intellectual property.
- Design, fabricate and test state-of-the-art sensors.
- Integrate developed sensors with CMOS electronics with proper process characterization and testing
-Benchmark developed sensors through experiments, troubleshoot and redesign devices.
-Model performance of fabricated sensors (analytical/numerical) to provide insight and predictive capability to aid in the design process
- May interface with academic collaborators to shape the research efforts and leverage findings
-Ability to design and execute experiments, interpret experimental data using tools such as Matlab or equivalent. ,
-Work closely with other team members towards a common goal, and interface to internal and external partners such as external labs and foundries for refining system architecture requirements and/or process development
-Participate in planning, contribute to intellectual property and scientific publication
-Report progress and share other responsibilities as assigned
-Ability to plan research projects, prepare reports and manuscripts for publications
-Excellent written and oral communication skills
-Superior critical thinking, analysis and problem solving skills, comfort with ambiguity, and being part of a team.
-Ph.D. in engineering or science
-Experience in developing and characterizing microfabricaton process modules (MEMS or electronics processing experience or both), start to end fabrication, testing and characterization of micro fabricated devices.
-Experience with measurement electronics and designing and building electronic measurement apparatus (at least 2 of mechanical design, PCB design, and/or LabView or equivalent)
-Experience in MEMS research as witnessed through publications and/or patents
-Knowledge of basic mechanical engineering concepts is desirable, ideally with experience in MEMS device design, characterization and testing.
Small Business Postdoctoral Research Diversity Fellowship Program
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